01Semiconductor Packaging Equipment
Application Requirements
Semiconductor packaging and testing processes demand high precision and stability. Motion systems must maintain accuracy under high-speed operation while minimizing vibration and positioning errors.
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Typical Application
Chip bonders, wafer inspection and testing, semiconductor packaging equipment.
02AOI Optical Inspection
Application Requirements
Stable and precise motion is critical when scanning under wide-field and high-magnification optics. Any micro-vibration can directly impact image clarity and inspection accuracy.
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Typical Application
PCB defect inspection, optical inspection modules, and more.
03Laser Processing
Application Requirements
Laser processes such as cutting, scribing, and marking demand high-speed motion and high thrust, while maintaining precise positioning to ensure accurate and repeatable tool paths.
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Typical Application
Laser cutting, laser scribing, micromachining, and more.
04Mini LED & Micro LED
Application Requirements
Inspection and bonding processes require high-precision alignment stages with long-term motion stability to ensure yield and consistency in large-scale transfer and assembly.
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Typical Application
LED die inspection, mass transfer systems, alignment and bonding platforms.